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Advanced Sensors and Electronics Technology (ASET)
In the quest to reduce the size, weight and power consumption of digital imaging sensors and electronics for spaceborne systems, ITT has developed the next level in focal plane technology - advanced sensors and electronics technology (ASET). ASET uses application-specific integrated circuits (ASICs) to ensure high levels of sensor and electronics integration in an ultra-lightweight focal plane subsystem configuration weighing 14 lbs. This design approach produces a 10x reduction in imaging sensor size, weight and power over today's focal plane units. The result is greater mission flexibility, lower launch costs, simplified support structures, built-in redundancy and fault tolerance, and improved reliability. Qualified for low earth orbit, ASET packaging is ruggedized for the harshest MIL-spec environments. Functionality in Fewer Parts More functionality on fewer parts is a key ASET feature. In the analog signal processor alone, one ASIC chipset replaces 72 discrete components in prior subsystem designs. Pixel processing speed is also a key goal. ASET processors can scan and process more than 20 million pixels per processing channel per second. By accommodating ever-higher pixel flow rates, ASET requires fewer processing channels - and fewer discrete circuits and parts - to operate the camera. ASET is Scaleable ASET architecture provides affordable flexibility to meet all your application needs.  Modular architecture provides 2 dimensional scalability: spectrally (rows) and spatially (modules) Panchromatic sensors consist of 14,000 pixel array building blocks ITT multi-line multi-spectral sensors feature thematic mapper bands 1,2,3,4 on a single chip with up to 7,000 pixels per block in each spectral band
ASET sensor packages deliver cutting-edge performance for advanced remote sensing applications: Light sensitivity: Indium Tin Oxide (ITO) process increases quantum efficiency greater than 60% Low weight: as low as 14 lbs. (total subsystem) Low power: as low as 25W @ 10 klps; 124W @ 50klps High coverage rate: scan up to 50k lines/sec Operational flexibility: bi-directional; TDI up to 64 stages High resolution: 8 micron pixel pitch, 14,000 pixels per module Efficient digital output: 11 bits per pixel data rate compressed to 2bpp
ITT expertise and sensor technology is augmented by electronics packaging and interconnect technology from Harris Aerospace, the industry leader in flight qualified multi-chip modules (MCM) and electronics. |
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